Scope
The topics to be addressed include, but are not necessarily limited to the following:
- THZ DEVICES
- NOVEL MATERIALS AND PROCESSING
- DRIFT AND RELIABILITY MECHANISMS
- NEW DEVICE CONCEPTS GRAPHENE AND CARBON NANOTUBE DEVICES
- WIDE BANDGAP POWER ELECTRONICS
- SIMULATION AND MODELING
- MICROWAVE AND MILLIMETER WAVE DEVICES
EXMATEC has been based on biennial meetings for 20 years. The scope of EXMATEC includes material fabrication, characterization and processing of compound semiconductors. Work on devices are also appropriate in this context.
The conference topics apply to all compound semiconductor materials, related structures and processing.
Exmatec has been previously held in Lyon (1992), Parma (1994), Freiburg (1996), Cardiff (1998), Heraklion (2000), Budapest (2002), Montpellier (2004), Cadiz (2006), Lodz (2008), Darmstadt (2010) and Porquerolles (2012).
In 2014, EXMATEC will be organized by FORTH in Delphi (Greece) from Wednesday, June 18, 2014 to Friday, June 20, 2014 with a one day overlap with WOCSDICE.
The topics to be addressed include, but are not necessarily limited to the following:
- ADVANCED CHARACTERIZATION TECHNIQUES
- DEFECTS
- BULK & EPITAXIAL GROWTH
- GRAPHENE & 2D SEMICONDUCTOR SYSTEMS
- III-Vs, III-Ns, II-VIs, SiC, SiGe
- NANOSTRUCTURES (Physics & Devices)
- INTERFACES & HETEROSTRUCTURES
- RELIABILITY ISSUES (physics of failure and degradation mechanisms)
- PHOTOVOLTAICS (Materials & Technology)
- DEVICE PROCESS TECHNOLOGY